HYTAC® W was CMT's first commercially-produced epoxy syntactic foam. With low thermal conductivity and CTLE associated with the syntactic structure, it proved to the thermoforming industry that felt-covered wood plugs could be resigned to the dustbin of history. While still used in low-volume or low-cost applications, W has been supplanted by other, superior levels of HYTAC® materials.
Low thermal conductivity and specific heat
This translates to lower heat transfer reducing warm-up time and virtually eliminating material sticking to the plug.
Dimensionally stable
The low coefficient of thermal expansion means the plug maintains its shape over a wide temperature range.